On July 9, 2026, Micron Technology said it would raise its US investment plan to more than $250 billion through 2035, expanding on a prior $200 billion program, with the buildout centered on memory production for AI.
July 9, 2026 · Micron Technology
Micron lifts US investment to $250B+ through 2035, betting on AI memory
The company added roughly $50 billion to its prior $200 billion plan, accelerating a buildout centered on High Bandwidth Memory (HBM) for AI — with capacity effectively sold out through 2026.
$250B+
total US investment planned through 2035
40%
of Micron's DRAM targeted for US production
~90–100K
direct & indirect jobs expected
How the $250B+ breaks down
Each block ≈ $50 billion
~$150B
Domestic memory
~$50B
Research &
Plus a separate strategic investment of up to $3B to strengthen the US semiconductor supply chain.
HBM4 nearly triples bandwidth
Peak bandwidth per stack — HBM4 delivers 2.3× the prior generation
Both in production · HBM4 adds 20%+ better power efficiency · US capacity sold out through 2026
Why it matters
Confirms structural strength of AI infrastructure demand
Only US-based advanced memory maker; key NVIDIA supplier
Low-power HBM3E helps cut data-center operating costs
Domestic output reduces reliance on Taiwan
Execution risks
Construction delays and staffing challenges
Price pressure as SK Hynix & Samsung ramp HBM
Supply expected to stay tight beyond 2027
HBM4 output expansion begins from 2026
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