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Intel and Broadcom CEOs Warn Capital Crunch May Outpace Chip Shortage as AI Bottleneck

  • Foundation Models
  • Infra & Chips
  • Funding & M&A

Broadcom CEO Hock Tan and Intel CEO Lip-Bu Tan cautioned Monday that access to capital, not semiconductors or electricity, could emerge as the dominant constraint on artificial intelligence infrastructure expansion through the end of the decade. Speaking at the DBS Asia Future Forward Conference in Singapore, the executives outlined a shift in thinking about what limits AI growth. While semiconductor shortages dominated headlines in prior years, both leaders argued that financing challenges and pressure to demonstrate returns on investment now pose the greater threat to the industry's buildout plans.

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