Oracle, Broadcom, and SpaceX Tap Billions in Private Debt for AI Chip Build-Out

Tech giants Oracle, Broadcom, and SpaceX are pursuing tens of billions of dollars in debt financing to fund a surge in AI chip acquisition and custom semiconductor development, signaling how the industry's infrastructure build-out has outpaced traditional capital markets. The three companies—along with lenders including Apollo Global Management, Blackstone, and Goldman Sachs—are in advanced talks for massive bespoke debt packages: Broadcom seeks over $50 billion (potentially $60 billion) to finance custom tensor processing unit chips for OpenAI's infrastructure; Oracle is targeting $45–50 billion in combined loans and bonds, including a separate $7 billion deal with Tencent for advanced chips across Southeast Asia data centers; and SpaceX is working toward a $40 billion financing package to acquire Nvidia AI processors for its AI operations.